Features

Higher Density and Performance: Compared to 1st-order HDI boards, 2nd-order HDI boards achieve higher interconnect density and signal transmission capabilities by adding outer copper layers and increasing the number of layers.

Support for Complex Designs: Suitable for high-density routing and complex circuit designs.

Optimized Signal Integrity: Reduced signal interference and electromagnetic crosstalk through microvia technology and thin dielectric layers.

Advantages

High Signal Transmission Speed: Small line spacing enables fast signal transmission.

Excellent Electrical Performance: Stable resistance, capacitance, and inductance parameters ensure stable device operation.

High Reliability: Compact structure maintains good performance in harsh environments.

Design Flexibility: Supports complex 3D designs, adapting to various shapes and space requirements.

Applications

Consumer Electronics: Smartphones, tablets, gaming consoles, requiring high-density routing and miniaturized design.

Automotive Electronics: In-vehicle infotainment systems, advanced driver-assistance systems.

Telecommunications: 5G base stations, routers, requiring high signal integrity and complex circuit design.

2nd-order HDI boards represent an advanced form of HDI technology, offering higher interconnect density and signal transmission capabilities by adding outer copper layers and increasing the number of layers. They support complex circuit designs and optimize signal integrity, meeting the demands for high performance and miniaturization in modern electronics. Widely used in consumer electronics, automotive electronics, and telecommunications, 2nd-order HDI boards are an essential solution in modern electronics manufacturing.