Welcome to Zhejiang Mingtehan Electronics Technology Co., Ltd.
13566043962

Consumer Electronics PCBA

Wearable device PCBA board
Wearable device PCBA board

Wearable device PCBA board

Basic Parameters

Layers: Typically 2 or 4 layers, depending on the complexity of the device.

Materials: High-performance insulating materials such as FR-4, polyimide (PI).

Size: Ranges from 10mm×10mm to 100mm×50mm.

Component Types: Integrated MCU, sensors (heart rate, accelerometer), Bluetooth modules.

Surface Finish: Supports lead-free HASL, immersion gold.

Product Description
  • Features

    Miniaturized Design: Utilizes HDI technology to achieve smaller line spacing and more compact sizes.

    Low Power Consumption: Optimized circuit design to extend device battery life.

    High Integration: Multiple functional modules integrated into a single PCB, reducing device size.

    Environmental Adaptability: Waterproof, dustproof, and vibration-resistant.

     

    Advantages

    High Performance and Reliability: Optimized PCB design and material selection ensure stable operation in complex environments.

    Miniaturization and Portability: HDI and microvia technology achieve smaller size and lighter weight.

    Low Power Design: Supports low-power Bluetooth and optimized power management systems to extend battery life.

    Customization: Supports customized design and assembly based on customer requirements.

     

    Applications

    Health Monitoring: Smartwatches, fitness bands supporting heart rate, blood pressure, and sleep monitoring.

    Sports Assistance: Motion trackers recording sports data and providing sports suggestions.

    Smart Accessories: Smart glasses, smart clothing supporting multiple functions.

    Medical Devices: Portable medical monitoring devices supporting remote healthcare.

     

    Wearable device PCBA boards achieve high performance and portability through miniaturized design, low-power optimization, and high integration. They support complex functional requirements and ensure device stability and reliability through optimized materials and processes.